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Solder Paste – 500g | High-Quality Soldering Paste Sn63Pb37


  • Alloy Composition: Sn63Pb37 (63% Tin, 37% Lead) for reliable electrical conductivity and strong bonding.
  • Particle Size: 25–45 μm, perfect for precision applications.
  • Weight: 500 grams – suitable for extended use in industrial or professional settings.
  • Mark: N-grade quality for consistent and top-notch performance.
  • Manufacturer: ZS.HX China – a renowned name in soldering materials.
  • Excellent wetting properties for clean, smooth solder joints.
  • Eutectic composition ensures a low melting point of 183°C, minimizing thermal stress on components.
  • Packaged to maintain freshness and prevent contamination.

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Product Description:

The Sn63Pb37 Solder Paste is a high-quality eutectic soldering solution specially designed for precise and efficient soldering in electronic manufacturing and repairs. With a particle size of 25–45 μm and a net weight of 500 grams, this solder paste is ideal for fine-pitch components and advanced circuit boards. Manufactured by the trusted ZS.HX China, it ensures superior adhesion, smooth application, and optimal soldering performance.

Key Features:

  • Alloy Composition: Sn63Pb37 (63% Tin, 37% Lead) for reliable electrical conductivity and strong bonding.
  • Particle Size: 25–45 μm, perfect for precision applications.
  • Weight: 500 grams – suitable for extended use in industrial or professional settings.
  • Mark: N-grade quality for consistent and top-notch performance.
  • Manufacturer: ZS.HX China – a renowned name in soldering materials.
  • Excellent wetting properties for clean, smooth solder joints.
  • Eutectic composition ensures a low melting point of 183°C, minimizing thermal stress on components.
  • Packaged to maintain freshness and prevent contamination.

Applications:

  • PCB assembly and repair.
  • Surface-mount technology (SMT) soldering.
  • Suitable for hobbyists, professionals, and industrial use.

Cautions:

  • Toxicity Alert: Contains lead. Use in a well-ventilated area and avoid inhaling fumes.
  • Storage: Store at 0°C to 10°C in a sealed container to prevent oxidation and drying.
  • Handling: Wear protective gloves and avoid direct skin contact. Wash hands after use.
  • Disposal: Dispose of unused solder paste responsibly as per local regulations.
  • Alloy Composition: Sn63Pb37 (63% Tin, 37% Lead) for reliable electrical conductivity and strong bonding.
  • Particle Size: 25?45 ?m, perfect for precision applications.
  • Weight: 500 grams ? suitable for extended use in industrial or professional settings.
  • Mark: N-grade quality for consistent and top-notch performance.
  • Manufacturer: ZS.HX China ? a renowned name in soldering materials.
  • Excellent wetting properties for clean, smooth solder joints.
  • Eutectic composition ensures a low melting point of 183?C, minimizing thermal stress on components.
  • Packaged to maintain freshness and prevent contamination.

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